| 1. Memory (K) |
2. NAND Flash : 9 |
3. Small Classification
(SLC : Single Level Cell, MLC : Multi Level Cell,
SM : SmartMedia, S/B : Small Block)
1 : SLC 1 Chip XD Card
2 : SLC 2 Chip XD Card
4 : SLC 4 Chip XD Card
5 : MLC 1 Chip XD Card
6 : MLC 2 Chip XD Card
7 : SLC moviNAND
8 : MLC moviNAND
A : 3bit MLC MONO
B : 3bit MLC DDP
C : 3bit MLC QDP
D : SLC Dual SM
E : SLC DUAL (S/B)
F : SLC Normal
G : MLC Normal
H : MLC QDP
K : SLC Die Stack
L : MLC DDP
M : MLC DSP
N : SLC DSP
S : SLC Single SM
T : SLC SINGLE (S/B)
U : 2 STACK MSP
W : SLC 4 Die Stack |
4~5. Density
12 : 512M 16 : 16M 28 : 128M
32 : 32M 40 : 4M 56 : 256M
64 : 64M 80 : 8M 1G : 1G
2G : 2G 4G : 4G 8G : 8G
AG : 16G BG : 32G CG : 64G
DG : 128G LG : 24G NG : 96G
ZG : 48G 00 : NONE
6~7. Organization
00 : NONE 08 : x8
16 : x16
8. Vcc
A : 1.65V~3.6V B : 2.7V (2.5V~2.9V)
C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V ~ 2.9V)
E : 2.3V~3.6V R : 1.8V (1.65V~1.95V)
Q : 1.8V (1.7V ~ 1.95V) T : 2.4V~3.0V
U : 2.7V~3.6V V : 3.3V (3.0V~3.6V)
W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE
|
9. Mode
0 : Normal
1 : Dual nCE & Dual R/nB
3 : Tri /CE & Tri R/B
4 : Quad nCE & Single R/nB
5 : Quad nCE & Quad R/nB
9 : 1st block OTP
A : Mask Option 1
L : Low grade
|
10. Generation
M : 1st Generation
A : 2nd Generation
B : 3rd Generation
C : 4th Generation
D : 5th Generation
11. "─"
|
12. Package
A : COB C : CHIP BIZ
D : 63-TBGA F : WSOP (Lead-Free)
G : FBGA H : TBGA (Lead-Free)
I : ULGA (Lead-Free) J : FBGA (Lead-Free)
M : TLGA N : TLGA2
P : TSOP1 (Lead-Free) Q : TSOP2 (Lead-Free)
S : TSOP1 (Halogen, Lead-Free)
T : TSOP2 U : COB (MMC)
V : WSOP W : Wafer
Y : TSOP1 Z : WELP (Lead-Free)
|
13. Temp
C : Commercial I : Industrial
S : SmartMedia
B : SmartMedia BLUE
0 : NONE (Containing Wafer, CHIP, BIZ, Exception
handling code)
3 : Wafer Level 3
|
14. Bad Block
B : Include Bad Block
D : Daisychain Sample
L : 1~5 Bad Block
N : ini. 0 blk, add. 10 blk
S : All Good Block
0 : NONE (Containing Wafer, CHIP, BIZ, Exception
handling code)
|
15. Pre-Program Version
0 : None
Serial (1~9, A~Z) |
16. Packing Type
- Common to all products, except of Mask ROM
- Divided into TAPE & REEL(In Mask ROM, divided into
TRAY, AMMO Packing Separately)
|
| 17~18. Customer "Customer
List Reference" |